What is a Wlcsp package?
Freescale Semiconductor, Inc. 3 Wafer Level Chip Scale Package (WLCSP) 3.1. Package Description. Wafer Level Chip Scale Package refers to the technology of packaging an integrated circuit at the wafer level, instead of the traditional process of assembling individual units in packages after dicing them from a wafer.
What does Wlcsp stand for?
WLCSP
Acronym | Definition |
---|---|
WLCSP | Wafer Level Chip Scale Packaging |
WLCSP | Wafer Level Chip Scale Packing (DDR RAM package) |
What is CSP in semiconductor?
CSP(Chip Size Package) is a product whose package substrate size does not exceed 120% of the semiconductor chip size. To reduce the area size, the CSP with highly dense wiring compared to general BGA is formed. The most important goal of CSP is to reduce the mounting area size.
What is wafer level assembly?
Wafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer.
Is Wlcsp flip chip?
The wafer level chip scale package (WLCSP) is a variant of the flip-chip interconnection technique where all packaging is done at the wafer level. With WLCSPs, the active side of the die is inverted and connected to the printed circuit board (PCB) using solder balls.
What is WLP in Semiconductor?
What is Wafer-Level Packaging? Wafer-level packaging (WLP) is the technology of packaging the die while it is still on the wafer—protective layers and electrical connections are added to the substrate before dicing. Originally, wafers were diced into individual chips, then packaged.
What does WLP mean?
WLP
Acronym | Definition |
---|---|
WLP | White Label Partnership |
WLP | World Language Program |
WLP | Whole Life Performance (construction) |
WLP | Workplace Learning Professional |
What is the difference between BGA and CSP?
Package Type Definitions The term BGA covers a wide range of package types. In this article, BGA refers to a 35-mm or larger device with 760-µm solder balls. The term CSP describes devices with 250-µm solder balls and an interposer layer between the die and solder balls.
What is RDL in semiconductor?
Redistribution layers (RDLs) are the copper metal interconnects that electrically connect one part of the semiconductor package to another. RDLs are measured by line and space, which refer to the width and pitch of a metal trace. Higher-end RDLs may be at 2μm line/space and smaller.
What does WLF mean?
WLF
Acronym | Definition |
---|---|
WLF | World Lung Foundation (New York, NY) |
WLF | Waist Level Finder (camera viewfinder type) |
WLF | Wisconsin Law Foundation (est. 1951) |
WLF | We Love Fine (clothing retailer) |
What are WLCSP chip-scale packages?
Wafer-Level Chip-Scale Packages (WLCSP) are the smallest possible packages that scale down to the same size as the silicon die. These are manufactured such that bumping, ball drop, and testing are done at the wafer-level.
What is the process flow for WLCSP devices?
The majority of WLCSP processing is done with the device in wafer form. The general process flow for WLCSP devices is: • Front-End Processing – The front-end process is where the additional dielectric and metal layers are applied to the chip while in wafer form to create WLCSP functionality.
What is WLCSP used for?
The WLCSP package family is applicable for a wide range of semiconductor device types from high end RF WLAN combo chips, to FPGAs, power management, Flash/EEPROM, integrated passive networks, standard analog and some automotive applications.
What is the land pattern of the WLCSP?
The WLCSP is a surface-mountable package with bottom ball termination of its external connections. The land pattern design for all WLCSP is based on the IPC-7351 and IPC-7095 standards. A Non Solder Mask Defined (NSMD) pad design is recommended for all board pads, as shown in the following figure.